High density designs
Max thickness 0.180”(4.5mm)
Max panel size 24X42”(612X1070mm)
Line/space to 3.0/3.0 mils (76um/76um, inner layers)
Min core 1.0 mils (25.0um)
Via in pad (POFV/VIPPO)
0.2mm drill size
0.5mm BGA
Various structure types
1.N+N;
2.N+N+N;
3.N+2+N
Processes available:
LDI (Laser Directing Image)
8 camera post-etch punch
CCD Back-drilling
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