HDI = High Density Interconnect (Micro via)
Layer count –up to 34 L
Maximum thickness – 200mils (5.0mm)
Max panel size 24X36”(612X916mm)
Laser hole size : 3.9 ~ 16mil
Various structure types:
1+N+1
2+N+2
3+N+3
Various via types:
Staggered , Skip Vias 1-4, Stacked
Via-in-pad designs
Epoxy filled
Via filling
Plated over filled via (POFV/VIPPO)
Conformal, large window , DLD Process
Currently 14 Gauss +2 Top-hat CO2 laser drills
Used in hi-speed line cards
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